Products

tec-speed 20.0 ceramic-filled hydrocarbon thermoset material series now comes in four new low passive intermodulation (PIM) antenna-grade versions: L300, L330, L340 and H348.

Read more: Ventec Extends tec-speed 20.0 Series of Low PIM Antenna-Grade Laminates

Comprehensive video training library includes 77 of IPC’s most popular video training titles as a subscription or as mini-libraries focused on hand soldering, electronic assembly inspection, electronic and wire assembly and electrostatic discharge fundamentals.

Read more: IPC Releases Comprehensive Video Training Library

ECXML (Electronics Cooling XML) open neutral file format makes it possible to share design models among different thermal simulation toolsets.

Read more: ANSYS Develops ECXML Open File Format for Thermal Simulation

Nitrile ESD gloves complement Nitrile ESD and Latex ESD finger cots.

Read more: ACL Staticide Rolls Out Nitrile ESD Gloves

Narrow-pitch connectors use tough-contact technology and include flat printed circuit and flexible flat cable connectors, as well as board-to-board and board-to-FPC types.

Read more: Panasonic Introduces Narrow-Pitch Connectors

Geode laser-based micro-via drilling system is for high-density interconnects on rigid printed circuit boards.

Read more: ESI Launches Geode Laser Drilling System

Page 110 of 403