No. 813 is a gas-heated 500°F(~260°C) walk-in oven, currently used for curing printed circuit boards.
LabVIEW 2018 software is for test workflows. Includes new tools that reportedly simplify system integration and grant more control through hardware accessibility.
Ansys 19.1 delivers new analysis capabilities in the electromagnetics suite for designing wireless communication, autonomous and electrification technologies.
Stanna-COF immersion tin enables chip-on-film (CoF) technology.
Cupracid Flex and InPro Flex are designed for standard conformal flex applications.
tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.