TWLS and TZA electrodeposited copper foils are now arsenic-free. All traces of arsenic have been removed from the treatment process.
XJTAG DFT Assistant free software interface for Mentor Xpedition Designer increases design for test and debug capabilities of the schematic capture and PCB design environment.
BondFilm HF is for treatment of innerlayer cores.
Electra v. 7.20 shape-based autorouter has improved completion rate and quality for high-density designs.
9176-800 series low-profile insulation displacement connectors reduce Z-axis height of 9176-400 series 1mm; reduce volume of standard 00-9176 series IDCs more than 50%.
Carbon Zebra connector makes electrical contact using 140 conductive pads per in. when placed between PCB and LCD display.