RO4730G3 UL 94 V-0 antenna-grade laminates are now manufactured with standard profile electrodeposited copper foil to meet performance requirements in active antenna arrays and small cells, notably in IoT applications and 5G wireless systems.
Provide low dielectric constant (Dk) of 3.0, held to a tolerance of ±0.05 through the thickness (z axis) when measured at 10GHz. Are reportedly 30% lighter than PTFE circuit materials and feature glass transition temp. (Tg) of better than +280°C for compatibility with automated assembly techniques. Exhibit z-axis coefficient of thermal expansion (CTE) of 30.3 ppm/°C from -55 to +288°C for PTHs in multilayer circuit assemblies and are Pb-free-process compatible.