Products

Amalga enables fabrication of hollow, metal waveguide and coaxial structures inside and on top of electronic substrates.

Read more: Integra Devices Introduces Amalga Waveguide Manufacturing Process

IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates.

Read more: Rogers Rolls Out IM Series High-Frequency Laminates

AD300D 4th gen. commercial microwave and RF laminate material extends capabilities of AD300 product.

Read more: Rogers Introduces AD300D RF Laminates

BR series raised element through-hole current sense resistors have 1W, 3W, and 5W power ratings.

Read more: Stackpole Electronics Offers BR Series Current Sense Resistors

CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.

Read more: Rogers Releases CU4000 LoPro Foils

RO4450T bonding materials are 3.2-3.3Dk, low loss, spread-glass reinforced, and ceramic-filled.

Read more: Rogers Debuts RO4450T Bonding Materials

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