Products

RO4835T laminates are offered in 2.5 mil, 3 mil and 4 mil core thicknesses, are 3.3 Dk, low loss, spread-glass reinforced, ceramic-filled thermoset materials.

Read more: Rogers Introduces RO4835T Laminates

Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts library option. 

Read more: DfR Solutions Rolls Out Sherlock Automated Design Analysis Software v. 5.4

Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.

Read more: Rogers Unveils Arlon raPld Substrates

XYR-03-01 alignment stage is a high-resolution, high-repeatability x-y-theta stage for wafer alignment, semiconductor handling, laser cutting and drilling.

Read more: Optimal Engineering Rolls Out XYR-03-01 Alignment Stage

HDTF substrates can incorporate conductor multilayers.

Read more: Remtec Offers HDTF Substrates

Etchable gold thick film process for high-definition thick film circuitry is an alternative to thin films.

Read more: Remtec Rolls Out Etchable Gold Thick Film Process

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