What’s all this noise? Look beyond the wires and connectors to think inside the box.
You can’t always hear it, feel it or see it, but every active electronic device radiates some kind of energy as it operates. For the most part, that’s the point. We want to hear the music; we want to feel the air conditioning or see the light. Those are the good things.
Meanwhile, we don’t want side effects: static on the radio, compressor noise from the AC or that annoying 60Hz hum from the light fixture bleeding over to my new bass amp. It’s these things we try our best to design out of the products we build.
We can adjust the tuner on the radio, and we can install the central AC unit away from the windows. I ordered a noise suppressor and plugged it into a socket where there’s no dimmer switches or high current motors plugged in. Then the amplifier and pedal board power cords were routed into the special apparatus, and I no longer get a wave of white noise when this MacBook Pro searches for a WiFi signal.
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Why a 3-N-3 stackup is the sweet spot.
The leading cause of HDI requirements comes from the chip vendors. The original ball grid array packages supported regular vias. Little by little, the pins got cozier. The 1.27mm pitch became 1mm, then 0.8 down to 0.65mm center-to-center. This was the final node where plated through-hole (PTH) vias was an option.
The next step down is 0.5mm class BGAs. We can still use a through-via embedded in the solder pad, but there are two issues. One, the via must be filled and capped to produce a flat surface that doesn’t permit solder to drain away during reflow (FIGURE 1). The other is that the typical “8/18” via has a finished hole size of 0.2mm and a capture pad of 0.45mm. On a 0.5mm pitch device, that leaves 50µm for a trace and an airgap on either side of the trace. That’s not practical.
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Anticipate the assembler’s needs in placement and routing.
We already design for fabrication, assembly and test. DFx can be extended to thinking about future uses of an assembly. Sometimes a printed circuit board needs to be revised right away. There are things we can do to facilitate rework. Clearly marking all the components is a good start. A robust design will lend itself to touch-up and rework scenarios. Let’s dive into some techniques.
Breadboarding for “science projects.” Ever seen a breadboard? In PCB design terminology, a breadboard is a rectangle with a grid of plated through-holes set on the same pitch as a DIP package (FIGURE 1). The holes will accept axial-leaded components as well as the odd transistor package. Notice the rows of pins are tied together but can be cut as required by the mad scientist in the lab. Jumper wires on the leads create the rest of the circuit. Development boards can usually afford a slimmed down version of this.
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Why you should take the time to use the dimensioning tool.
One of the many hats worn by a board designer is that of draftsperson. Before settling into a position doing layout, I had a contract to create drawings on vellum – with a pencil! Before they turned me loose, the manager asked me to write my name and phone number on a piece of paper. That was all it took; get to work. Ever since seventh grade drafting class, my normal handwriting has been in all caps. We no longer need legible handwriting to land a job, but some of the things I learned at Cavro Scientific have stuck with me all these years.
Dimensions and tolerances. The electronic data alone are enough to fabricate a board most of the time. Whether it’s an omnibus file like IPC-2581 or a collection of Gerber and drill data, the hole size and locations are provided with the circuit pattern. Why take the time to use the dimensioning tool? Here’s why. Someone must inspect the PCB before it leaves the fabricator. Someone else inspects it on the way into the assembly factory. All the fab and assembly drawings are inspection documents.