Tips for avoiding EMI and simplifying debugging.
Power distribution on a PCB can come in a number of forms. The three most common methods are:
Route power and ground.
Use surface layer floods.
Use internal planes.
A user’s guide to clear communication of parts and intent.
A good portion of a quality build is simply the result of clear information. One of the more important pieces of information we deal with is the bill of materials, called “the BoM.”
The BoM is a list of all the components to be placed on the PCB. The file typically includes an index number, the number of times a specific component will be used on the board, the reference designator from the schematic, the component manufacturer, and the manufacturer’s part number.
If a specific component is used more than once – a common bypass capacitor, for example – it will still only take up one line in the BoM. One field in the BoM will list the number of times the component is used, and another field will list all the reference designators for that part number. In FIGURE 1, for example, line 5 in my BoM is a 0.1 microfarad, 10V capacitor.
Some traditional routing strategies can increase crosstalk.
Excessive solder on the pad could result in a floating part.