Designer’s Notebook

John Berrie

Using buildup layers and premium FPGAs to deal with SI challenges.

Read more: Return Vias, Buildup Layers and the Latest FPGAs

Duane Benson








Mask the pins to keep solder where it belongs.

Read more: Surface Mount Power Component Footprints

Patrick Carrier

Knowing the right geometries is a crucial start.

Read more: Obtaining Accurate Analysis that Matches Measurements

Although declared inactive nearly 20 years ago, the DLA spec remains alive in use.

Read more: An Explanation of MIL-I-46058C for Conformal Coatings

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