Designer’s Notebook

John Berrie

Using buildup layers and premium FPGAs to deal with SI challenges.

Read more: Return Vias, Buildup Layers and the Latest FPGAs

Duane Benson

 

 

 

 

 

 

 

Mask the pins to keep solder where it belongs.

Read more: Surface Mount Power Component Footprints

Patrick Carrier

Knowing the right geometries is a crucial start.

Read more: Obtaining Accurate Analysis that Matches Measurements

Although declared inactive nearly 20 years ago, the DLA spec remains alive in use.

Read more: An Explanation of MIL-I-46058C for Conformal Coatings

Page 6 of 16