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Homepage Slideshow

July 2013 Issue

Published: 01 July 2013
 by Staff

July 2013 cover

 

FEATURES

Design Planning
A Lean NPI Journey
A design bureau/EMS explains its implementation of Lean NPI, which relies on concurrent DfM analysis using vendor-supplied rule sets during PCB layout and improved data transfer.
by Randy Holt

Flex Circuits
Connecting Flex Layers Using Conductive Paste
A new flexible printed circuit method, called paste via, uses no copper plating and reduces board thickness by nearly 30%.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Talent over tools.
    Peter Bigelow

 

TECH TALK

  • On the Forefront
    Next-gen packaging.
    E. Jan Vargerman

  • Designer’s Notebook
    Overcoming impedance discontinuities.
    Charles Pfeil

  • Flexperts
    Bonding stiffeners.
    Mark Finstad

  • Technical Abstracts
    In case you missed it.

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