June 2009 PCD&F Cover


A Solar Cell Primer for the PCB Industry
Manufacturing methods, like screen-printed paste, are giving way to photolithography, inkjet deposition and plating, as solar cell manufacturing techniques evolve.
by Don Cullen

High-Speed Interconnects
Improving Via Design for High Data Rate Applications
Controlling via impedance and minimizing reflection are important when designing via structures because via-hole transitions are a major contributor to signal degradation.
by Yuriy Shlepnev

NPI Awards
PCB Fabrication Suppliers’ Spotlight
Throughout the PCB supply chain, companies continue to invest in R&D to meet the changing market requirements.
by Kathy Nargi-Toth

Improving the Multilayer PTFE Fabrication Process
Good drilling and registration are critical to the success of microwave designs because embedded filters and couples can be adversely affected by poor hole quality and misregistration.
by Thomas F. McCarthy, Oliver Zhu, Anthony Serafino and Brigitte Lawrence

Improving Dry Film Lamination Yields
Maintaining the correct, uniform pressure in the lamination process can increase yields by reducing opens and eliminating dry film wrinkles.
by Jeffrey G. Stark and Karl H. Dietz

Advantages of Isotropic PCB Routing
Isotropic routing systems can help reduce the total wire length by 25% to 40%, while reducing the number of vias.
by Sergey Luzin and Oleg Polubasov

BGA Routing
Fan-out Strategies for Fine-Pitch BGAs
Working together, PCB designers and fabricators can explore manufacturing techniques that optimize designs, reduce routing layers and minimize PCB costs.
by Ishtiaq Safdar and Syed Wasif Ali



Our Line
Positive energy.
Kathy Nargi-Toth

In times of uncertainty, resources like time and talent can be game changing.
Peter Bigelow

Positive Plating
Plating defects can have multiple origins, so don’t jump to conclusions.
Michael Carano

Interconnect Strategies
PCB stackup influences board impedance, signal integrity and EMI performance of the system.
Dr. Abe Riazi

Final Finish Forum
Opening screen apertures to cover the entire pad can overcome the incomplete solder spread experienced with OSPs in lead-free assembly applications.
George Milad

Designer's Notebook
Augmenting DfM and DfA with predictive first-pass yield analysis offers a comprehensive view of manufacturing performance.
Mark Laing



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