The Black and White of Immersion Tin
Keeping an eye on cupric ions can eliminate black tin deposits.
by Allan Wilcox
The R&D Outlook for 2009
Last but not least, the final installment of interviews with 2009 NPI Award winners.
by Kathy Nargi-Toth
Tackling the Copper Wrap Plate Requirement
Wrap plating improves reliability of via structures, but conventional techniques increase copper thickness, limiting HDI and other fine-line designs.
by Rajwant Sidhu, Ph.D.
Designing With Buried Capacitance
Without a rule of thumb to determine which designs will be enhanced by buried capacitance, each must be evaluated independently.
by J. Lee Parker, Ph.D.
Thick-Film Circuits with Silver Via Holes
A low-cost solution for flexible circuits can be manufactured using silver conductive paste and screen-printing techniques.
by Hhisayuki Kawasaki, Masafumi Nakayama, John Rufiange and Dominique Numakura
Managing Crosstalk and Ground Bounce
Designing for higher speeds and operating frequencies demands close scrutiny to minimize the effects of unwanted energy transfer and noise in the system.
by Syed W. Ali
Embedded Chips Redefine Miniaturization
Inexpensive, high-performance packages can be fabricated by laminating thin, flexible, mechanical devices into conventional multilayer circuit boards.
by Els Parton, Wim Christiaens and Jan Vanfleteren
Effective Use of Split Planes
Split planes affect ground currents, making it difficult to determine the impact on design performance without first knowing where the ground current is going.
by Dr. Michael L. Steinberger
POINT OF VIEW
Diagnostic ware… wear… where?
Companies, that creatively align capability with customer needs, reduce the risk of becoming excess capacity.
On the Forefront
For many package subcontractors, the road to recovery won’t be smooth.
E. Jan Vardaman
Over time, the feedback loop of testing, adjusting and retesting can significantly improved PCB reliability.
SIR must be designed for, especially in high-frequency boards.
Dr. Harald Wack
Final Finish Forum
A complete analysis of the manufacturing process can aid in troubleshooting solderability problems.
A review of IPC-2152, Current Carrying Capacity for Printed Board Design.
From the Field
An interview with Manny Marcano, president and CEO of EMA Design Automation.
With the right tools, embedded passives are as easy to design into a PCB as traditional, externally mounted components.
Off the Shelf