FEATURES

From the Field
Endicott Interconnect: Filling the Gap
An investigation of blind and thru via fill techniques for semiconductor
package and printed circuit board applications.
by Kathy Nargi-Toth

PCB Trends
2007: The Year of HDI?
A reader survey reveals 2007 will be the year microvias and embedded passives make their mark.
by Mike Buetow

DFM Guidelines
Achieving High Density Designs Without Compromising Manufacturability
Successful DFM is a team concept that requires good communication
throughout the design process.
by James Blankenhorn

Resources
PCD&M Annual Buyers Guide
A valuable resource for locating materials and information related to printed circuit design and fabrication, published in both online and print editions.

Shows
IPC Expo/APEX Product Preview
A snapshot of new products that will be featured at IPC Expo/APEX 2007.

POINT OF VIEW

Our Line
Protecting innovation.
Kathy Nargi-Toth

ROI
Being grounded and specific with your goals for the New Year will result in success.
Peter Bigelow

The OEM View
Enabling wickedly compelling mobile devices with greater functionality and elegant form factors.
Aroon Tungare

EMC for the Real World
Smart designs consider the return current path to ensure EMI/EMC performance.
Dr. Bruce Archambeault

Career Care
Avoiding these common job search errors will help you stand out in a crowd.
Ted Daywalt

The Signal Doctor
Tracking transmission line losses.
Dr. Eric Bogatin

The Flex Market
When will Japan’s economic boom trickle down to the worker?
Dominique Numakura

DEPARTMENTS

Ad Index

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