2007 Issues

Dominique Numakura Read more: TPCA Show 2007 Review

As design disciplines converge, the ability to display, exchange and work in 3D will become an essential part of the electronic product development process.

Read more: ECAD-MCAD Design Integration

Microvias are more reliable than through holes, so adding HDI to the design can improve reliability and reduce cost.

Read more: HDI Via Structures Effect on PCB Design Flexibility, Constraints and Cost

For designers, working with metric units increases performance and overall quality.

Read more: Metric Pitch BGA and Micro BGA Routing Solutions

Aspect ratio is important in defining the flow rate through a hole, but hole diameter and the agitation speed are equally significant.

Read more: The Fluid Mechanic Modeling of PCB Plating Solutions

µPILR technology can reduce the standoff between the PCB and the bottom package and increase mechanical board-level reliability, improving drop-test performance.

Read more: A New Approach for Finer Pitch Package-on-Package in Mobile Devices

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