2007 Issues

Peter Bigelow Read more: Pricing Limbonastics
Michael Carano Read more: Achieving an ENIG Resistant LPI Solder Mask Process

New materials sets and design innovations are needed to handle the higher heat transfer demands of today's denser circuitry and increased clock speeds.

Read more: Thermal Management in Advanced Microelectronics
Eric Bogatin Read more: What You See Isn’t Always What You Get

High pin count BGAs capture significant improvements in thermal and electrical performance.

Read more: BGA Escape/Routing Patterns for Fine-Pitch Devices

This year it was a one-stop show, from PCB design, to fabrication, through testing and into assembly.

Read more: 2007 JPCA Show Technology Summary

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