2007 Issues

Thermal modeling balances the tradeoffs between thermal compliance and signal integrity requirements.

Read more: Improved Thermal Design of PCBs Using Surface Optimization Modeling

New materials sets and design innovations are needed to handle the higher heat transfer demands of today's denser circuitry and increased clock speeds.

Read more: Thermal Management in Advanced Microelectronics

LDI exposure holds promise to reduce or eliminate solder mask in hole issues.

Read more: Solder Mask Challenges for New HDI Designs

To accommodate faster signal rise and fall, designers need to apply good placement and routing techniques.

Read more: Basic Electronics for PCB Design

High pin count BGAs capture significant improvements in thermal and electrical performance.

Read more: BGA Escape/Routing Patterns for Fine-Pitch Devices

This year it was a one-stop show, from PCB design, to fabrication, through testing and into assembly.

Read more: 2007 JPCA Show Technology Summary

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