ENDICOTT, NY – Endicott Interconnect Technologies Inc. (EI) has been awarded a research and development contract by the US Department of Defense. The $12 million contract supports the continued development of advanced high-speed electronic packaging technologies, including printed circuit boards (PCBs), system development and substrate design.
 
EI has expanded and modified its existing facilities and purchased equipment to support the scheduled work. The company also plans to hire additional employees. “The work for the DoD needs to be performed within the boundaries of the United States, so we are actively recruiting engineers across multiple disciplines to develop the next generation of scientists and engineering support personnel,” explains Rajinder Rai, vice president of R&D and general manager of Integrated Circuit Assembly Services at EI.