Fab News

CHANDLER, AZ – An Isola subsidiary has renewed Nan Ya Plastic’s license for a patented reverse treat foil technology.
 
The agreement between Polyclad Laminates Inc. and Nan Ya concerns the Drum Side Treated Foil (DSTF) technology for dense circuit formation and high-speed signal transmission. DSTF reduces the cost of a processed inner layer when compared to standard shiny foils.
VIENNA, AUSTRIA – AT&S has reinvented itself within the mobile device market, which accounts for nearly 64% of the company’s sales.
 
Going forward, AT&S will focus on the high-end segment of the market, where complex applications and demand for smaller devices necessitate the accelerated development of technologies to meet these needs.
 
Although a loss in market share, especially with customers in the low-cost segment, is expected, AT&S believes the move will strengthen its long-term position in the high-end segment. It will increase its focus on new technologies, such as rigid-flex solutions, production of finer structures and embedding components inside circuit boards. Investments are also planned.
 
Because of the company’s new strategic orientation and the unstable global economy, AT&S does not expect to see financial growth in its 2009/10 and 2010/11 fiscal years. Although, through focusing on its core competences, retaining its global presence and maintaining its technological orientation, the company foresees a beneficial positioning for future growth.
 
ELK GROVE VILLAGE, IL – Electronic Interconnect Technology (EI) has been UL certified for metal-clad PCBs with a standard dielectric and now offers a range of PCB thermal management materials.
 
The company can work with numerous thicknesses of aluminum and copper metal cores, providing precise machining tolerances and fabrication services for thermal management and long-term board reliability. EI also provides design counseling services, thermal analysis and feedback.
 
“The materials we use provide outstanding thermal performance with high dielectric strength and low capacitance,” said Pratish Patel, president and CEO. The carefully engineered constructions can eliminate the need for fans, heat spreaders and heat sinks, he explained. 
VIENNA, AUSTRIA – AT&S expects fiscal year 2008/09 revenue to fall 7.2% to around 450 million euros (US$598 million). A dividend of 0.15 euros to 0.18 euros (US$0.20 to $0.24) is estimated.
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NEW BEDFORD, MA – Epec LLC. has named Derek Dixon director of engineered electronic product sales. Prior to joining Epec, Dixon was the business development manager at GM Nameplate Inc.
 
“We have been searching for a leader to work closely with our engineering and sales organizations to make it easier for our customers, from design through delivery.  Derek has demonstrated great success in our growing product sectors and we are proud to have him with us,” said Ed McMahon, CEO.

PLYMOUTH, MN – Innovex Inc. has named Stephen Lai senior vice president of worldwide sales and marketing. He will be responsible for increasing revenue with current major customers, as well as identifying and developing additional customers.
 
Lai brings nearly 35 years of experience in the electronics industry. Prior to joining Innovex, he worked for several companies, including IBM, RCG Holdings and Motorola.
 
“Steve has proven, throughout his career, his ability to work with customers to create profitable revenue growth. We are very excited to have him join our team and I am confident he will rejuvenate our sales efforts to provide Innovex with the sustainable growth necessary for long term success” said Terry M. Dauenhauer, president and CEO.

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