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    Component Land Patterns

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Fab News

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Category: Fab News
KITTANNING, PA – Dielectric Solutions has filed an Involuntary Chapter 11 Petition in US Bankruptcy Court, according company officers.
 
The action is intended to give the company court protection from a breach of contract by customer and investor Isovolta AG.
 
In November, the company filed suit against not only Isovolta and its US subsidiary, Isofab Inc., but also two officers from the companies. The suit alleges that Isovolta infringed on Dielectric’s patented flat fiberglass fabric and submitted a fraudulent patent.
 
Dielectric also alleges that Isovolta attempted to restrict sales and to control the company’s business and technology in an attempt to eliminate Dielectric as an independent supplier to the electrical insulation industry.
 
The company plans to prosecute the complaint while under bankruptcy protection, according to Dielectric officials.
 
Despite layoffs in March, it does not plan to shutter the facility, according to Ken Beer, vice president of marketing. The company has continued to satisfy orders and remains operational. “It’s not our intent to do anything but grow our business,” he adds.

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Category: Fab News
MELVILLE, NY – Park Electrochemical Corp. has named Marty Kendrick vice president of operations. He will be responsible for the company’s operations in Asia, Europe and North America, excluding Park’s advanced composite materials operation in Waterbury, CT. 
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Category: Fab News
CHANDLER, AZ – An Isola subsidiary has renewed Nan Ya Plastic’s license for a patented reverse treat foil technology.
 
The agreement between Polyclad Laminates Inc. and Nan Ya concerns the Drum Side Treated Foil (DSTF) technology for dense circuit formation and high-speed signal transmission. DSTF reduces the cost of a processed inner layer when compared to standard shiny foils.

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Category: Fab News
VIENNA, AUSTRIA – AT&S has reinvented itself within the mobile device market, which accounts for nearly 64% of the company’s sales.
 
Going forward, AT&S will focus on the high-end segment of the market, where complex applications and demand for smaller devices necessitate the accelerated development of technologies to meet these needs.
 
Although a loss in market share, especially with customers in the low-cost segment, is expected, AT&S believes the move will strengthen its long-term position in the high-end segment. It will increase its focus on new technologies, such as rigid-flex solutions, production of finer structures and embedding components inside circuit boards. Investments are also planned.
 
Because of the company’s new strategic orientation and the unstable global economy, AT&S does not expect to see financial growth in its 2009/10 and 2010/11 fiscal years. Although, through focusing on its core competences, retaining its global presence and maintaining its technological orientation, the company foresees a beneficial positioning for future growth.
 

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Category: Fab News
ELK GROVE VILLAGE, IL – Electronic Interconnect Technology (EI) has been UL certified for metal-clad PCBs with a standard dielectric and now offers a range of PCB thermal management materials.
 
The company can work with numerous thicknesses of aluminum and copper metal cores, providing precise machining tolerances and fabrication services for thermal management and long-term board reliability. EI also provides design counseling services, thermal analysis and feedback.
 
“The materials we use provide outstanding thermal performance with high dielectric strength and low capacitance,” said Pratish Patel, president and CEO. The carefully engineered constructions can eliminate the need for fans, heat spreaders and heat sinks, he explained. 

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Category: Fab News
VIENNA, AUSTRIA – AT&S expects fiscal year 2008/09 revenue to fall 7.2% to around 450 million euros (US$598 million). A dividend of 0.15 euros to 0.18 euros (US$0.20 to $0.24) is estimated.
 
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