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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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LoadCore 5G Core (5GC) network test software enables users to perform network capacity tests, measure device data throughput and model end-user behavior and mobility scenarios.

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LabVIEW Community Edition and LabVIEW NXG Community Edition are for use on personal projects.

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Gore microwave/RF assembly builder is a step-by-step online tool that configures and requests a quote for an assembly with connector and cable options, assembly lengths, and frequencies.

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ScanExpress v. 9.6.0 boundary scan software includes ScanExpress Runner Analytics.

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XCBOM software analyzes bills of materials and searches databases of North American component distributors for parts with the same specification but lower pricing.

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Samtec HSEC8 micro pitch edge card socket incorporates higher-cycle edge rate contact.

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