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MacDermid Alpha Releases Systek SAP Buildup Process

Published: 04 June 2020

Systek SAP buildup processes for IC substrate RDL have a four-step desmear process that can be calibrated to prepare multiple substrate materials, imparting minimal roughness while ensuring clean via side walls and copper target pads.

Subsequent conditioner process ensures adsorption of palladium catalyst into substrate. Copper metallization process includes ionic palladium activation system, zero-stress electroless copper metallization process, and optional anti-tarnish. Semi-additive processes provide toolset for creating RDL with dimensions down to 5/5µm line/space for high-density packaging.

MacDermid Alpha
MacDermidAlpha.com

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