D-2970 Dynamic series compact wire-to-board PCB connectors have field-installable push-in clamp terminations.

NFM18HC106D0G3L multilayer ceramic capacitor is for automotive safety-critical applications. Is three-terminal low-ESL MLCC.

BLM18SP_SH1 chip ferrite beads for noise suppression are for use in automotive power supply applications.

Systek SAP buildup processes for IC substrate RDL have a four-step desmear process that can be calibrated to prepare multiple substrate materials, imparting minimal roughness while ensuring clean via side walls and copper target pads.