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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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Onyx direct metallization system is for high-reliability and complex printed circuit boards.

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UMT-W pulse-proof SMD ceramic fuse has time-lag tripping characteristics.

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Rohm Solution Simulator web simulation tool simultaneously verifies power devices and ICs on 44 different solution circuits.

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Box-shaped Sarcon thermal interface caps are available in standard sizes to fit many transistors and can be custom-ordered to exact specifications.

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TF13 series back-flip FPC/FFC connector features 0.4mm pitch, 0.9mm height, and 3mm mounting depth.

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N9021B MXA X-Series signal analyzer offers an enhanced frequency sweep algorithm, accelerating test time improvements.

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