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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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NFM18HC106D0G3L multilayer ceramic capacitor is for automotive safety-critical applications. Is three-terminal low-ESL MLCC.

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BLM18SP_SH1 chip ferrite beads for noise suppression are for use in automotive power supply applications.

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Systek SAP buildup processes for IC substrate RDL have a four-step desmear process that can be calibrated to prepare multiple substrate materials, imparting minimal roughness while ensuring clean via side walls and copper target pads.

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GRM011R60J104M multilayer ceramic capacitor features max. capacitance of 0.1µF in 008004".

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SMT PCB connectors transmit signals or power across PCBs.

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The 0.5mm-pitch FH67 series FPC connector with single-action lock satisfies automotive requirements and is commonly used in consumer, gaming, industrial, medical and robotics applications.

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