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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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MKP1848H series of automotive-grade DC-Link metallized polypropylene film capacitors are optimized for high humidity environments.

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KiCad plugin allows searches and downloads of SnapEDA CAD models directly within the KiCad PCB design environment.

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X1000 direct imaging system performed dry-film patterning and solder mask imaging.

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PCB antennas are for Wi-Fi, GSM, CDMA, 3G, 4G, LTE, GPS, Bluetooth, ZigBee, ISM and NB-IoT applications.

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F98-AJ6 series capacitors are available in 0603 and 0805 chip sizes with max. heights of 1mm and 0.8±0.1mm and feature facedown under-tab terminations designed to achieve high capacitance, high volumetric efficiency, and high PCB assembly densities.

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SFP-DD I/O interconnects are new double-density cages and surface mount connectors.

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