New Products

Si9000e v. 20.03 contains extended substrate data library that allows user to enter tables of frequency vs. dielectric constant and loss tangent.

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ThermaWick THJP surface-mount thermal jumper chip transfers heat from electrically isolated components by providing a thermal conductive pathway to ground plane or common heatsink.

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Hyaline bio-manufactured film for electronics applications can be used in flexible circuits, display touch sensors and printable electronics. Is completely transparent.

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MacuSpec THF 100 single-step copper through-hole filling process enables improved thermal and structural designs for IC substrates.

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B24-SSB Bluetooth strain transmitter provides instant wireless Bluetooth signal from strain gauge sensor sent directly to mobile phone or tablet.

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Several materials have been added to the Speedstack online and On-premise libraries, including: ITEQ IT-968SETC core and IT-968SEBS prepreg materials; TUC TU-87P SLK Sp prepregs and TU-872 SLK Sp cores; Isola IS550H prepregs and cores; Arlon 35N, 85HP and 85N cores; and Shengyi Autolad1 cores and Autolad1B prepreg.

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