Si9000e v. 20.03 contains extended substrate data library that allows user to enter tables of frequency vs. dielectric constant and loss tangent.
ThermaWick THJP surface-mount thermal jumper chip transfers heat from electrically isolated components by providing a thermal conductive pathway to ground plane or common heatsink.
Hyaline bio-manufactured film for electronics applications can be used in flexible circuits, display touch sensors and printable electronics. Is completely transparent.
MacuSpec THF 100 single-step copper through-hole filling process enables improved thermal and structural designs for IC substrates.
B24-SSB Bluetooth strain transmitter provides instant wireless Bluetooth signal from strain gauge sensor sent directly to mobile phone or tablet.
Several materials have been added to the Speedstack online and On-premise libraries, including: ITEQ IT-968SETC core and IT-968SEBS prepreg materials; TUC TU-87P SLK Sp prepregs and TU-872 SLK Sp cores; Isola IS550H prepregs and cores; Arlon 35N, 85HP and 85N cores; and Shengyi Autolad1 cores and Autolad1B prepreg.