ICCON Block and ICCON Insert connectors address high current rating demands from high-speed board-to-board and board-to-busbar data communication applications.

VEMD4010X01 and VEMD4110X01 surface-mount automotive-grade silicon PIN photodiodes come in 0805 case size with 0.7mm profile.

Blackhole LE and Eclipse LE modified semi-additive processing (mSAP) for direct metallization enable direct copper electroplating to laminate walls and copper target pads of microvia structures without need for intermediary copper layers from electroless or electrolytic flash plating.

inspectAR 2.3 includes the ability to add comments within the context of the PCB, create custom names and save overlay sets.