IX60G series horizontal mount PCB connector supports space-constrained applications that require Cat.6a Ethernet cabling.

CircuEtch 200 anisotropic final etch for circuit formation in semiadditive and modified-semiadditive processes (SAP/mSAP) is used in IC substrate and substrate-like HDI manufacturing.

IHVR-4024KE-51 high current inductor provides 50% lower DCR than typical power inductors for improved efficiency in high frequency DC/DC converters.

TIVP Series (IsoVu Gen 2) extends applications for isolated probe technology to all of power system design with a smaller size, improved ease of use, and enhanced electrical performance.