F98-AJ6 series capacitors are available in 0603 and 0805 chip sizes with max. heights of 1mm and 0.8±0.1mm and feature facedown under-tab terminations designed to achieve high capacitance, high volumetric efficiency, and high PCB assembly densities.

SFP-DD I/O interconnects are new double-density cages and surface mount connectors.

JTAG ProVision 2020 PCBA test development software further simplifies processes for testing modern PCB assemblies fitted with miniature components in highly integrated packages.

XFdtd 3-D EM simulation software has new features to address 5G millimeter wave antenna design challenges, including support for high-performance tuners and singularity correction.