SMP product series includes connectors and terminators. SMP connectors are ideal for telecommunications and military applications that require compact board-to-board RF interconnect.
MacuSpec VF-TH 300 VF-TH series electroplating is for processes used in mSAP HDI manufacturing.
Cadence Clarity 3D Transient Solver is a system-level simulation that solves electromagnetic interference system design issues up to 10x faster than legacy 3-D field solvers.
PathWave advanced design system software 2021 now comes with design cloud simulation services. Reduces simulation time, increases simulation test coverage and provides access to scalable hardware resources in the cloud.
Wilson RH2150 Rockwell hardness tester is available in two different sizes, with a vertical capacity of 10" and 14".
TekBox TBRFH1 RF shielded housings are ideal for enclosing prototype RF building blocks operating up to 6GHz.