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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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3DCS Design Variation Modeler creates scalable solution to tolerance analysis and simulation.

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Automate Mini-Fakra connectors support up to 20Gbps data transmission.

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CSL1501RW ultra-compact side-emitting infrared LED is ideal for head-mounted displays, industrial headsets and VR/MR/AR (xR, virtual reality) gaming systems.

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Free height computer-on-module (COM) connectors with 0.5mm centerline address vertical, parallel and board-to-board connections that require high-speed data transmission and different stacking heights.

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Speedstack 21_02 supports a new shield material type, allowing the addition of shielding materials for rigid and flex printed circuit constructions.

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Atlas for Anritsu ShockLine vector network analyzers is for production testing of PCB insertion loss.

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