New Products

TIVP Series (IsoVu Gen 2) extends applications for isolated probe technology to all of power system design with a smaller size, improved ease of use, and enhanced electrical performance.

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Modified-PI FPC combines MPI and low dielectric adhesives to achieve higher resistance to bending and heat and similar transmission properties to liquid crystal polymer FPC.

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Card edge power connectors now include single-beam, HD-heightened, HD-plus 5- and 8-beam connectors.

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X3000 LDI system reportedly can handle the largest panels for dry-film patterning and solder mask imaging in PCB production.

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V410-H handheld barcode reader reportedly captures challenging codes, including direct part marks and ultra-compact symbols.

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ScanExpress boundary scan 9.8.0 software includes optional ScanExpress JET advanced diagnostics for detailed memory test diagnostics with automated analysis.

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