Gauss Stack PCB stack-up design and simulation software includes an extensive dielectric materials library that enables rapid specification and implementation of a complete stack-up design that includes both electromagnetic and thermomechanical simulations, fully integrated, with no additional user input of material data required.

Reportedly accurately predicts resin starvation and glass stop issues and provides board level thermomechanical properties including coefficients of thermal expansion (CTE) in all directions — x, y and z axis (both above and below Tg). Enables predictions of failure modes at the stack-up design stage, assessing how resin content, glass weave, retained copper percentage, and other aspects of a design impact board-level properties or manufacturability and reliability of boards.

Specific features include: accurate modeling of insertion loss by accounting for ground plane losses; accurate prediction of resin starvation and glass stops that includes the effect of dielectric filler and conductor roughness; simulation of PCB thermomechanical properties critical for reliability predictions; further simulation, based on board-level thermomechanical properties, of plated though-hole reliability, microvia reliability and solder joint reliability; simulations for impedance and frequency and roughness dependent losses associated with dielectric materials, for the full stack-up with one click; and synthesis to simulate line widths required to achieve a target impedance, again for the full stack-up with one click.

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