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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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AEC-Q200-qualified TCQ series conductive polymer chip capacitors are for automotive, industrial, and telecommunications applications.

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LCCI series ultraminiature multilayer ceramic chip inductors are for high-frequency RF applications.

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µPOL embedded DC-DC converters now include a 5W to 40W DC-DC multimodule reference design that reportedly enables concept to design in fewer than 15 min.

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PCB design project management tool suite provides management of PCB design projects and allows early collaboration on data of projects.

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Max-M12 high-speed connectors include X coding with support for 10Gb/s (1000M Ethernet with CAT6 cable) data transmission and S coding for safer connection with First Mate Last Break.

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Sigrity X signal and power integrity (SI/PI) software features new simulation engines for system-level analysis.

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