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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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RV8C010UN, RV8L002SN and BSS84X ultra-compact AEC-Q101 qualified MOSFETs are 1mm2.

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IX60G series horizontal mount PCB connector supports space-constrained applications that require Cat.6a Ethernet cabling.

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CircuEtch 200 anisotropic final etch for circuit formation in semiadditive and modified-semiadditive processes (SAP/mSAP) is used in IC substrate and substrate-like HDI manufacturing.

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IHVR-4024KE-51 high current inductor provides 50% lower DCR than typical power inductors for improved efficiency in high frequency DC/DC converters.

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TIVP Series (IsoVu Gen 2) extends applications for isolated probe technology to all of power system design with a smaller size, improved ease of use, and enhanced electrical performance.

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Modified-PI FPC combines MPI and low dielectric adhesives to achieve higher resistance to bending and heat and similar transmission properties to liquid crystal polymer FPC.

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