Amkor Technology has announced the introduction of FusionQuad, a package technology designed for budget-conscious thermal performance applications.
FusionQuad is a leadframe-based, plastic package which integrates
bottom lands within a standard QFP package outline. The company claims
that the combination of peripheral leads and bottom lands allows for an
approximate doubling of I/O with an approximate 50% reduction in body
size for an existing lead count. Initial package options range from 100
to 376 I/O, in single and dual row bottom land configurations, and with
sizes ranging from 10 to 24 mm, at 0.8 mm thickness.
Agilent
Technologies’ Medalist x6000 PCB X-ray inspection system uses a digital image
reconstruction technique to diagnose solder-joint defects in PCBs.
Using
this Laminography technique, the company reports that PCBs can be examined by looking at
"slices" at various z-values above the board surface, with the image
in sharp focus for one plane of the board. Software then examines these
individual image slices for defects, and can also use them to build a
three-dimensional image of the entire board structure.
"Our
new approach eliminates the time required for z-movement and board settling
associated with laminography. With the architecture of the x6000, we completely
eliminated that step, improving test throughput, simplifying test-program
development, reducing the system's parts count, improving call performance by
ensuring that images are in focus, and improving system reliability,” commented
Jim Benson, product marketing engineer
"Overall
we believe that the new system architecture addresses present and future
inspection needs, just as laminography provided the best solution for
printed-circuit-boards' prior generation."
VANVCOUVER –
Design software vendor Capilano Computing and PCB supplier
Pad2Pad.com are jointly offering free packages for schematic capture and
trace layout.
The packages permit circuits to be designed in the
DesignWorks Express environment, then exported to the Pad2Pad automatic
trace router. The design package reportedly handles up to 500 netlist
nodes.
A professional version is available for complex circuits,
advanced tools and optional digital simulation.
Ansoft Corporation has announced the release of Q3D Extractor v8
3D parasitic extraction software. The company states that the product
performs both 2D and 3D electromagnetic field simulation to extract
RLCG parameters from an interconnect structure, and generates a SPICE
circuit model for use in Nexxim and other Berkeley SPICE-compatible
tools.
These models provide EM-based design for on-chip passives for design
and optimization of high-performance structures to achieve claimed
first-pass timing results.
According to the company, Q3D Extractor v8 includes a new capacitance
solver capable of extracting the capacitance and conductance with lossy
dielectrics. This feature uses available computer memory to perform
multiple frequency evaluations, and allows users to model infinite
ground planes.
Additionally, the Ansoft desktop architecture has been added to the 2D
extractor tool. The company claims that this interface offers the
ability to perform discrete and interpolating frequency sweeps,
simplifies problem setup, and includes a scriptable report editor,
enhanced post-processing and product coupling capability with Nexxim
and Simplorer software.
Sensor Products Inc. has released its Pressurex product,
a tactile pressure indicating sensor film that maps and measures
pressure distribution and magnitude between contacting surfaces.
The product reportedly measures pressure from 2 - 43,200 PSI (0.14 -
3,000 kg/cm2) and is available in seven pressure ranges. When placed
between two contacting or mating surfaces, it permanently changes
color, with the color change directly proportional to the pressure
applied. Precise pressure magnitude is determined by comparing the
resultant color intensity to a color correlation chart similar to
Litmus paper. The company claims tht no training or instrumentation is
required.
The company also states that the product can be used for analyzing
contact uniformity in PCB assemblies and wafer fabrication, to verify
flatness and reveal lamination press problems caused by inconsistent
bonding pressures. It can also evaluate load distribution, revealing
overloaded connector contacts, standoffs, and component solder joints.
Zuken’s E.series 2008 allows users to determine software feature enhancements, according to the company.
Improvements include the economizing of tasks that previously required
multiple commands that are now done with the press of one button or
automatically, and improved multi-user capabilities, with the
introduction of hierarchical control for complex product design, as
well as the embedding of files as an external documents within the
design.
E.cable caters to the automotive, aerospace and military cable and
wire harness producers, and claims higher reliability earlier in the
design cycle, the support of industry design and legislative
requirements, and the easy placement of inliners in automotive
connections.
