Printed Circuit Design & Fab Online Magazine - New Products

New Products

The ST10-LC909 polyimide product is a claimed price competitive replacement for Thermount and Copper Invar Copper, and is used to control the thermal expansion of PCBs.

According to the company, the product closely matches ceramic and flip-chip type low coefficient of thermal expansion (CTE) components, and that a multi-layer board manufactured using polyimide and Copper Invar Copper or Thermount materials can be duplicated using layers of standard polyimide and ST10-LC909 embedded into the PCB. The process will reportedly match the CTE of an existing design, targeting a range from 9ppm/°C to 12ppm/°C, with a low Z-axis expansion.

stablcor.com

Christopher Associates Inc. has announced its introduction of the Machvision Hole Doctor verification system for printed circuit fabrication applications. The company states that the product is an in line conveyor system for the inspection and verification of hole count, hole diameter, location accuracy and hole quality on rigid, microvia/HDI, and flexible PCBs, and can be used after drilling, desmearing and plating or for final inspection or QC.

The company states the system can be programmed using a “golden board” or drill files to inspect hole diameters from .006” - .400” and up to 16:1 aspect ratios on panels from .010” to .400” thick. Claimed defect inspections include plugged holes, improper hole diameters, poor drilling accuracy, and other critical parameters using an XP-based SPC software package.

christopherweb.com

HC300 is constructed from a polyester resin with glass filament reinforcement. Flexible polyester additive claims increased toughness, and thin wall cross-sections without fracture. The material is claimed to be less rigid than 100% epoxy composites and compliant for most applications. In addition, polyester resin compliancy saves a claimed 35% on costs associated with mill bit replacement, as compared to typical epoxy resin materials.

dmipallet.com

Agilent Technologies Inc. has announced a 10x speed increase of its planar 3-D electromagnetic (EM) simulator, part of the Update 1 release of its Advanced Design System (ADS) EDA software platform. The speed improvement reportedly helps RFIC, RF module and high-speed gigabit serial-link designers take advantage of EM simulation for faster, more accurate design and signal integrity verification.

"The 10x speed improvement and meshing accuracy makes EM problem-solving possible for even very large and complex designs," said Jan Van-Hese, of the company's R&D division.

agilent.com

Arena Solutions has announced a new electronic design automation (EDA) adapter for integrating Arena's PLM product with engineering's schematic design tools. The adapter reportedly allows design and engineering groups to consolidate electronic component databases and get immediate access to information such as preferred parts, descriptions, parametric information, symbols, footprints, and datasheets. The company states that the adapter will work with Altium Designer, Mentor Graphics' DxDataBook, and Cadence's OrCAD Capture CIS, and others.

Currently concluding beta-testing, the company claims that a full version of the software will be available in June 2008.

arenasolutions.com

Camtek has announced the introduction of the Mustang line of automated optical inspection systems for high-density PCBs used in the production of mobile consumer products. The first Mustang Model 600 systems have already been installed at customer sites.

“The high density of printed circuit boards [used in mobile consumer products] increases their sensitivity to defects. Replacing manned microscopes by automated inspection makes sense to… manufacturers. We developed the Mustang... for fast, reliable and consistent defect detection.” said Yuval Agami, VP of Camtek.

http://www.camtek.co.il