Tyco Electronics has introduced HarnWare design software
V5.4, used for the production of drawings and specifications for wire
harnesses. The company reports that the drawing package produces a harness
assembly drawing, wire list, bill of materials, wiring schematic, weight
estimate, and 3 dimensional model.
www.harnware.com
APS announces Meg-A-Pak, for packaging up to 800 grams of
two-component reactive adhesives and sealants in flexible pouches. The company
reports that Meg-A-Pak provides a combination packaging/mixing burst seal
container for a variety of resin systems.
www.adhesivepackaging.com
Acura-BGA exposure unit is for IC substrate manufacturing. Reportedly permits accurate
contact between the artwork emulsion and printed circuit board surface, with
resolution to 10 µm. Is dedicated to outerlayers with uneven topographic
surfaces of 50-100 µm and to exposing soldermask panels with surface
irregularities.
Automa-Tech/ORC Imaging, www.automa-tech.com