Amkor Technology has announced the introduction of FusionQuad, a package technology designed for budget-conscious thermal performance applications.

FusionQuad is a leadframe-based, plastic package which integrates bottom lands within a standard QFP package outline. The company claims that the combination of peripheral leads and bottom lands allows for an approximate doubling of I/O with an approximate 50% reduction in body size for an existing lead count. Initial package options range from 100 to 376 I/O, in single and dual row bottom land configurations, and with sizes ranging from 10 to 24 mm, at 0.8 mm thickness.

www.amkor.com

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