GreenJet is reportedly the first fully digital solder-mask printing system for PCB production. Is said to replace conventional coating, drying, exposure and development processes with a one-step process. Is said to be adapted to the smaller pad spacing and the tighter registration tolerance requirements. Employs proprietary printing technology.
The film base connector is said to provide a small space interconnection with high-density flexible circuits. Micro bump arrays built on thin film substrates reportedly reduce the thickness of the connection height by more than 70% to 300 µm thick for over 100 pins.
With printable flexible electronics, finer patterns than 30 µm line and space reportedly can be generated with smaller via holes than 80 µm diameters for double sides or multi-layer flexible circuits. The multiple screen printing processes enable embedded passive for all of LCR and active components with thin flexible substrates, including polyimide and polyethylene naphthalate films.
The A5-A probe system automated test platform offers flexible loading and uploading, with a sensitive handling function. Incorporates four high-res CCD cameras for optical scanning. Reportedly automatically separates good and bad boards in a cycle time of less than 15 sec. Handles 100 x 72 mm to 610 x 460 mm board sizes. Minimum thickness is 0.8 mm (320 x 250 mm board size) and 0.6 mm (320 x 250 mm and smaller board size), with a maximum of 4 mm.
AVIA 355-7 Q-switched, frequency-tripled, solid-state laser is said to deliver more than 7W of average power at 355 nm. The highest average power reportedly is achieved at repetition rates near 60 kHz; can be operated at pulse rates as high as 100 kHz. Pulse width is less than 30 ns. Features include an automated crystal shifter and a THG crystal life of 60,000 hr.; automated stabilization mechanisms (first-pulse suppression, ThermEQ, PulseEQ, and PulseTrack); a Posilock beam position sensor and feedback loop, with a reported beam-pointing stability of <25 ÿrad/°C over the life of the laser. Is for via-hole drilling, chip singulation, scribing and dicing of silicon and low-K materials, and solar cell micromachining.
Flexible silicone conformal coating is said to be fast drying and designed to protect PCBs exposed to high humidity environments. Is available in 400 ml aerosol and a 5-l bulk container. Adheres to a variety of substrates and fluoresces under UV light for ease of inspection. Has an operating temperature ranging from -50° to +125°C. Reportedly is dry to touch at 20°C in 10 to 15 min. Contains no isocyan ates.
Cy-less II-W is a cyanide-free silver-plating process chemistry. Is said to feature bright, non-yellow appearance and even distribution. For PWB and other product applications.