This I/O Designer product is specifically for PADS®. The PADS I/O Designer product enables concurrent design by bridging the unique FPGA and PCB design flows, automating the various processes needed to implement today’s high pin-count, high-speed FPGAs on PCBs. The benefits: decreased design cycle time, improved performance, and lower product costs.
Continuous vertical Desmear electroless copper equipment is said to combine the process quality and production advantages associated with horizontal continuous platers. Said to have easier release of entrapped air and gas; uniform, high-volume delivery gained by the transport of panels past fluid delivery spargers. Advantages are said to include a high-reliability end product; improved 1st pass yield; the ability to process wide range of panel thicknesses without compromise on parameters; low CD strike/semi panel improves copper deposit properties. Process reportedly allows optimized de-smear on various substrates.
Process Automation International Ltd., www.palhk.com
Elpemer FP 207-1010 color-stable photoimagiable solder resist and Elpemer FP 207-1015 photoimagiable marking ink are screen-printable. Said to resist yellowing brought about by increased temperature stress during lead-free soldering.
ElepguardSL 1303 Nano-AQ-FLZ is a water-borne conformal coating based on acrylate resin with nano filling agents. Is colorless, transparent and fluorescent. Offers the properties of inorganic fillers without inhibiting clarity. The filling agents are said to improve the barrier effect – and thus film density – adhesion and chemical resistance. Is said to have high elasticity and mechanical stability, resist scratches and abrasions, and provide cold flexibility and thermal shock resistance. Meets IPC-CC-830 requirements. Solvent-removable.
These lead frames are for a wide variety of applications, including semiconductors, glass-to-metal seals and relays; are also used in medical applications such as hearing aids. Base materials include kovar, nickel-iron alloys, copper alloys and pure nickel; can be plated in entirety or selectively. Pb-free materials include silver, nickel, gold or tin, depending on customer conductivity requirements.
These large, high-complexity PCBs are for use in compute-intensive applications such as servers and mainframes for defense, aerospace and commercial applications. EI reportedly can provide high-density, double-sided hybrid PC board assemblies (SMT/PTH/press fit) with an average component count of > 1500, including high-I/O area array modules (CGA, LGA, PBGA) and dense, high-I/O connectors, in sizes as large as 32" x 44".