“We designed Impact to push the speed and density envelope of backplane interconnects in order to meet the growing demands of next generation telecommunication and data networking equipment,” said Brian Hauge, new product development manager.

The company states that the connector provides up to 80 differential pairs per linear inch in less than 29mm total width, speed capabiity at over 20 Gbps, and a two compliant pin design option. Additional features include a 1.90mm x 1.35mm grid on backplane and daughtercard, with a hybrid shielding design, which is claimed to provide low cross-talk, insertion loss and minimal performance variation across high speed channels.

The connector is available in three-pair through six-pair versions.

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