Omnitrol Networks and Texas Instruments Inc. (TI)
announced an alliance delivering a radio frequency identification (RFID)
product to PCB manufacturing applications. The product integrates Omnitrol
Networks' Work-in-Process software and TI's Gen 2 RFID technology and provides
electronic and contract manufacturers automated identifying and tracking of
PCBs from the manufacturing floor to customer delivery.
http://ti.com/pcbtracking
RFID's small chip size can reportedly allows PCB
manufacturers real-time work-in-process visibility into parts, labor and
finished goods throughout a manufacturing process. In addition, RFID solutions
provide claimed an accurate comprehensive view of manufacturing data on units
in production, including location, status, and time metrics.
Mikael Ahlund, of TI’s Instruments RFID Systems said,
"The PCB tracking solution combines Texas Instruments' experience in
electronics manufacturing along with our core competency in RFID with Omnitrol
Networks' Work-In-Process application appliance."
"The Omnitrol PCB tracking solution…allows us to
automatically maintain traceability on each component that goes into the
products we build. We have been able to replace… manual scanning with a
completely automated process," said Heinz Hornung, GM at TQ Components.
C-Boards can reportedly produce a printed circuit board from a PDF source file. The company claims that using a PDF source file is simpler and faster than using traditional Gerber files, and that the process allows the fabrication of a PCB in less than an hour.
C-Boards focuses on rapid turnaround single sided
boards, targeted specifically at prototype PCBs.
FR408HR improved lead-free compatible, low-loss laminate has a thermally and electrically enhanced resin system. The material is designed to meet new designs challenges of high layer counts, heavier copper weights and those that require higher bandwidth. FR408 HR has a Tg of 200ºC, a decomposition temperature of 356ºC. This combination results in a 35% reduction in Z-axis expansion and a 25% improvement in dielectric properties over competitive products in its space.
Showed no degradation in performance after testing under multiple passes at 260ºC assembly after a prolonged exposure to high humidity and temperature on 5.5 mm thick very high layer count boards.
Hirose has released low-profile flexible printed circuit ZIF connectors, distributed by Digi-Key. The FH26 Series features a 0.3 mm contact pitch and vertical height 1 mm above board profile.
The connectors are said to be lightweight, with a typical 51 contact
connector fully loaded weighing a claimed 0.1 gram, as well as having
solder leads on a 0.6 mm pitch on the front and back of the connector
allowing ease of solderability on a PCB. The company reports that
conductive traces on the PCB can run under the connector with no
exposed contacts.
Reported easy insertion and reliable connection are obtained from the company’s Flip Lock actuator that uses a tactile sensation when closed, confirming the electrical and mechanical connection.
The ZIF connector accepts standard thickness 0.2 mm standard Flexible
PCB. According to the company, typical applications include mobile
phones, PDAs, digital and video cameras, camera modules, LCD
connections, plasma displays, and high-reliability ultra-small profile
connectors.
Fujipoly announces the availability of its expanded Elastomeric Connector and Thermal Interface Material
reference guide. The free product overview and technical design catalog
contains performance data and installation suggestions for a wide
variety of thermally conductive materials ranging from thin films and
form-in-place materials to gap filler pads.
The product guide also features 19 pages of high density, low
resistance, electrically conductive silicone connectors for consumer
electronics and industrial applications.
Exopack Advanced Coatings’ Duratool Eclipse Micro Matte films reportedly use refined manufacturing and coating reformulations that incorporate more environmentally sensitive solvents.
In addition to claimed greater sustainability, the product reportedly
provides PCB makers with better chemical and scratch resistance, as
well as a high level of emulsion adhesion.
According to Greg Williams, VP at Exopack Advanced Coatings, “We are
using just two reformulated coatings which significantly reduce the use
of volatile organic compounds in the manufacture of these films."
Features of the new films include a claimed 100% camera inspection
coupled with automatic web marking, superior resolution of 1000
lines/mm, excellent densitometry and coatings on a 0.007-inch polyester
base for high stability and durability.
