Engelmaier Associates presents the report Recommendations for PCB FAB Notes and Specifications in Printed Circuit Board Drawings for SnPb and Lead-Free Soldering Assemblies, the Qualification of PCB Shops and Activities to Assure Continued Quality.

Version v.08 makes recommendations regarding appropriate specifications and fabrication notes on drawings for printed circuit boards, general procedures to qualify PCB shops, and testing procedures to verify quality and reliability. Provides necessary material selection information to supplement IPC-4101 slash sheets. Contains recommended examples of fab notes for SnPb solder assemblies and Pb-free assemblies, for use as general specifications on PCB drawings, a basic questionnaire to supplement to IPC-1710 for qualifying PCB shops, and recommendations for ongoing activities to ensure qualified PCB shops maintain internal quality.

 www.engelmaier.com

Agilent Technologies Inc. has released a limited access solution for In-Circuit Test (ICT) users that reportedly eliminates the need for physical test points. According to the company, Cover-Extend is part of the VTEP v2.0 powered test suite, and is a hybrid between the Boundary Scan test and VTEP Vectorless Test methodologies used in electronic manufacturing.

Cover-Extend uses stimulus provided by boundary scan cells, which do not require physical test points. The benefits include claimed improved test coverage, savings on fixturing operating cost, and strain relief on solder joints, resulting from fewer test probes needed underneath high-density ICs (e.g., BGAs).
 
"Cover-Extend addresses key concerns in today's manufacturing environment - cost, coverage, quality and speed," said Daniel Mak, VP and GM of Agilent's Measurement Systems Division. "The results we are getting from our customers' lines are very positive, and we will implement Cover-Extend in full-scale production environments…in April."

Agilent will conduct live demonstrations of Cover-Extend at two major test and inspection tradeshows: Apex 2008, April 1-3 in Las Vegas, NV, and Nepcon Shanghai 2008, April 8-11, Shanghai, China.

www.agilent.com

Tech-Etch has released the “V” Series variable finger snap-on BeCu gaskets for EMI/ RFI shielding. The company claims that by reducing the number of full snap-on fingers on a strip, shielding effectiveness is increased, since there are fewer gaps to close.

Claimed EMI/RFI shielding effectiveness is up to 100db attenuation. Each gasket is reportedly offered in five slot patterns with a snap-on mounting offering secure installation with high durability. The “V” Series is used in bi-directional applications, requires only a low closing force and closes gaps as small as .02”. Item numbers 187V32FXx, 250V37FXx and 282V60FXx are configurable to custom lengths.

www.tech-etch.com

Sunstone's Design For Manufacture (DfM) Add-On for Altium Designer is free and factory-certified. Implements the company's manufacturing capabilities interactively inside Altium Designer. Is said to reduce costs by reducing design errors; reduced time by using existing rule decks instead of user-created versions; and simplify design processes by following a factory-certified rule deck.

Sunstone Circuits, www.sunstone.com/pcb-resources/downloads.aspx.