CST Studio Suite 2012 is for design of EM-based components in application areas such as microwave and RF design, EMC and signal and power integrity analysis. Introduces System Assembly and Modeling environment to simplify simulation project management. Can set up 3D systems built of various components. Defines simulation tasks that include single or multiple components. Allows user to specify components to simulate in 3D and components to be represented by their S-parameters or an equivalent field source, to reduce computational effort. Enables full 3D creation and simulation.

Computer Simulation Technology, www.cst.com

Eagle 3D design converter exports 2D layouts from into Google SketchUp to create 3D prototype simulations. One-click export feature speeds printed circuit board design by creating a realistic image of the PCB, which can be closely examined for accuracy and modification. Combines multiple boards in the same model to check for misaligned connectors and collisions of tall components. Can be used to evaluate airflow around devices, and accessibility of test and mounting points. Converts mechanical models from STEP and IGES available on the manufacturers’ websites. Exports to other MCAD tools in STEP format, if necessary.

CadSoft, www.element14.com

InSight PCB pre-CAM flow includes input, buildup, cleanup, analysis and panel calculation. Is said to reduce load from CAM to sales and engineering and save time for CAM operators. Captures incoming PCB data and retrieves precise analyses needed to build accurate price quotes. Performs pre-CAM input quickly and cuts engineering lead-time by creating DfM reports and technical query snapshots in minutes. Identifies potential production problems. Works remotely, permitting tracking and managing RFQs from virtually anywhere. An advanced graphic validation process ensures high input success rates by halting input if contradictions are detected in the graphic data. InSight™PCB supports: RS274X, ODB++, DXF, HPGL, Excellon 1 and 2.

Frontline PCB Solutions, www.frontline-pcb.com

Ultrathin 40 micron laminate is glass-reinforced and does not have thermo-mechanical mismatch issues commonly associated with unreinforced films. Has a glass-transition temperature (Tg), above 170C. Young's modulus (Tensile Modulus) and thermal expansion coefficient are said to be similar to high-Tg systems.

Isola Group, www.isola-group.com

Circuit Foil, www.circuitfoil.com