New Products

UV-P50 direct imaging device supports in-house/ laboratory-type prototyping for printed circuit boards. Exposure time for a euroboard-size PCB takes typically fewer than 5 min. with a min. pattern size down to 100µm. Provides maskless direct imaging with UV LED technology. No mask alignment needed. Works with all industry-type photo-resists. Has automatic alignment in all three coordinates and auto focus function. Camera system detects registration drill holes in a range of about a few micrometers und corrects wrong position of PCB in a few seconds. Panel size: 400mm x 300mm. 

Limata, http://www.limata.de/en/UV_P50.html

Smartlam Model 5000 is designed to laminate a full range of printed circuit boards. Is capable of handling very thin to large heavy panels up to 12.7mm in thickness. Can be used as a pre-tack laminator for inline vacuum processes. Is provided with a data management system. Lamination pressure is adjustable up to 450 Kg; is controlled automatically by proportional valve. Is equipped with brushless servo-motor. Lamination roll temperature is controlled by IR sensor. 

Dynachem, http://www.dynachem.eu/products.php?tree_cod=001002

VHF 300 VS horizontal selective via hole filler with vacuum is designed for printed circuit board selective via hole filling, through holes and blind vias. PCB and stencil are placed horizontally onto the filling surface and clamped. Plunger (air pressure controlled) presses paste through stencil into the holes of panel. Paste is stored in reusable cartridges. Different heads are supplied for different panel sizes. Movement of Y-axis is controlled by servo motor. Touch panel display allows up to 50 recipes to be stored. Paste delivery is from a 12 oz, 6 oz, or smaller cartridge. Paste is pressed into the via fill head via pneumatic pressure on the back of the plunger in the cartridge. Pastes used are silver and copper paste (conductive) and epoxy fill (non-conductive).  Max panel size is 24" x 30".

MASS, www.mass-pcb.de

Zeta Lam combines Zeta Cap copper clad cured dielectric film and Zeta Bond B-stage adhesive. Foil weights range from 0.25 to 0.375 oz.; comes in 0.0005", 0.001" and 0.0015" thicknesses with adhesive bonds of 0.001" to 0.002".

Integral-HDI, http://www.integral-hdi.com

ALC 500-1 Series is for drilling and routing printed circuit boards that contain aluminum. Is equipped with two spindles with different collet systems: One has a 1/8" shank collet for standard tools and is mainly used for drilling; the other has a collet for 6mm shank tools to provide more stability for the routing process. Routing spindle is equipped with a lubrication system inside of the pressure foot to cool and lubricate tools.

Lenz, http://lenz-gmbh.de/en/products/aluminiumroutingmachine/-series-alc/1.html

SLG free form scoring machine has an automatic tool change system with tool length measurement. Is possible to have different shaped tools in the same program. Board can be scored on both sides simultaneously. Any 2D geometric shape can be scored without turning the board manually. Scoring depth can be set up individually for each side within the program. Exact jump scoring is supported. Bevels can be produced on one side, both sides simultaneously, or inside the printed circuit board. Permits vertical positioning of boards to score thin materials. Panels are located in pins and clamped pneumatically. Smaller PCBs can be arranged on a larger panel and split afterward.

Lenz, http://lenz-gmbh.de/en/products/scoring-machine/series-slg.html

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