Universal Contacts, for SMT, provide an electrical connection between a
device and a PCB.
Come as a single piece stamped product, incorporating pre-load and
anti-lift features, designed to replace traditional interfaces
requiring customized contacts. For use to connect a number of device
components in any direction and configuration using the same interface,
reducing qualification time. Come in heights of 1.3, 1.8, 2.5, 3.5 and
4 mm. So-called "solderwells" are said to prevent solder wicking up the
contact. Are WEEE and RoHS compliant.
The Antenna Modeling Design System is a 3-D, dedicated design, modeling and verification tool for antenna systems and placement. Is based on electromagnetic technology. Is said to reduce design and quality risks by simulating the entire wireless appliance together with its environment. Assures compliance with regulatory and operator demands such as over-the-air performance and specific absorption rate. Analyzes antenna diversity for multiple-in-multiple-out. Facilitates cross-functional teamwork between antenna and product designers and introduces real-world interaction with the human body directly into the EM simulation.
APTIV film, for high-end electronics such as high-density flexible circuits, features high temperature performance, chemical wear and hydrolysis resistance, superior mechanical properties, barrier (permeation) and electrical properties. Is high purity, halogen free, and RoHs and FDA compliant. Provides flammability protection without use of flame retardants. Come in widths up to 1.5 meters and thicknesses ranging from six to 750 microns.
LNP Starflam compounds provide flammability performance while meeting the requirements of halogen-free parts. The X-Gen Z270 family of fiber-reinforced polyamides supports compliance with WEEE, RoHS, and other environmental requirements. Combines non-halogenated flame retardance and low smoke performance, and meets UV94 V-0 standards at low thicknesses, as well as IEC60335 requirements. Said to provide outstanding thermal performance with an RTI of 140 ºC and robust electrical properties with a CTI of 600 volts. The portfolio includes PA6, PA6.6, PA6.6/6 blends, and other polyamides such as PPA and PA12. Currently injection moldable.
ROCHESTER, N.Y. - EMA Design Automation released TimingDesigner 9.0 that features Design Kits with assembled diagrams and libraries for commonly used parts and interface protocol standards.
The TimingDesigner design kits are pre-assembled component timing diagrams complete with all specified libraries for speed and voltage ratings. The kits have all documented timing protocols associated with one or more design components. According to EMA they are intended to give designers a quick start for timing analysis of their designs.
TimingDesigner is proposed to aid high-speed, multi-frequency designs by accurately modeling and analyzing the signal relationships between devices on a board or between embedded functions on an ASIC or FPGA. According to EMA it can evaluate comprehensive sets of timing alternatives and provide direction to the most complex of timing challenges.
TimingDesigner 9.0 will be available July 1, 2007.
SANTA CLARA, CA – Agilent Technologies Inc. announced the integration of its full-wave 3D simulator Electromagnetic Design System (EMDS) into the company's Advanced Design System (ADS) EDA software platform. The EMDS-for-ADS reportedly speeds up the design and verification process by reducing the steps necessary for accurate design of high-frequency RF/microwave modules, RF boards and planar antennas.
"Designers lose a lot of time translating a layout structure into another drawing environment, redefining the layer stacks and dielectric properties, assigning port numbers and reconnecting an S-parameter black box for co-simulation with active elements," said Bart Van Hecke, product manager with Agilent's EEsof EDA division. "Integrating our fullwave 3D EM simulator with the ADS circuit and system design environment eliminates the need for layout translation. It provides a 3D EM layout previewer that allows designers to check for drawing parameterization or errors before launching full-wave 3D EM simulations or optimization from the ADS circuit design environment."
At a price comparable to that of typical circuit simulators, EMDS-for-ADS makes full 3D EM simulation accessible to the entire ADS community of users, rather than just serve as a tool for EM experts.
The Agilent EMDS-for-ADS can also be used standalone as a fullwave 3D EM software platform, with its own complete 3D drawing and visualization environment for non-planar structures such as connectors, packages, machined parts and antennas.