BondFilm MS 500 is a super-concentrate that employs new additives. Has enhanced adhesion at standard etch depths; compatibility with a range of materials (high and low Tg, halogen-free). Offers good adhesion along copper loading curve in terms of initial peel strength. Great thermal reliability; acid resistance above five min.; copper loading window up to 28g/L.

Atotech, www.atotech.com

Oval Contact connector can deliver data rates up to 10Gbps per pair. Features improved signal integrity via reduced cross talk. Designed for high-speed applications, including 10/40G Ethernet, HDMI/DVI video, 1/2/4/8G Fibre Channel, SATA, Serial RapidIO and PCI Express. Is reportedly ideal for use in defense, commercial and industrial markets. Comes in nine insert patterns, the largest of which includes 21 differential pairs in a MIL-DTL-38999 series III shell size of 25.  Has front release, rear removable contact system. Uses off-the-shelf Mil Spec backshells. Solder cup, crimp and PCB tail termination contacts are available. Contact and plating materials are consistent with SAE-AS39029. Withstands a minimum of 500 mating cycles and features an operating temperature range of -65° to +175°C.

Amphenol Aerospace, www.amphenol-aerospace.com
 

Fortegra 351 toughening technology improves toughness of epoxy systems for laminates, adhesives, composites, castings and coatings. Is said to increase reliability and durability under high mechanical stresses during drilling process, while also helping maintain thermomechanical and electrical properties. Is based on dispersed preformed particulate toughening technology, which complements existing proprietary block copolymer technology.

Dow Chemical, www.dow.com

TimingDesigner 9.3 static timing analysis tool eases customization of diagrams and documentation Incorporates many supporting features to make styling and image exporting easier.