Model 5950 microfabrication system has beam steering technology for printed circuit board singulation. Designed to handle standard, fully occupied printed circuit boards. Features control cutting shape, throughput, and laser-material interaction. Can minimize spacing between adjacent devices. Reportedly eliminates carbonization. Is targeted for consumer electronics, specifically circuit boards for the mobile segment.

ESI, www.esi.com 

FasTRAK plasma system is an automated vacuum plasma treatment system for lead-frame strips, laminate substrates, and other strip-type microelectronic components. Uses robotic movement; reportedly accommodates full known range of magazines and strip width, length, and thickness dimensions. Designed to lower handling risk to sensitive substrate materials. Material tracking software and internal camera count the number of strips and track their progress throughout treatment process. Up to 10 strips can be accommodated per batch. Measures 1.65m x 1.5m. Includes a plasma chamber that can be configured for direct or ion-free plasma modes. Typical plasma applications include pre-die attach; pre-wire bond; pre-mold; post-mold, and pre-underfill. 

Nordson March, http://www.nordson.com/en-us/divisions/march/pages/default.aspx

K7000 singulates thin pre-scored panels with close component spacing. Is said to safely depanelize boards as thin as 0.020”.

DiPaMat Wh03 UV-curable legend ink features improved whiteness, adhesion and pencil hardness. Ink is RoHS-compatible. Contains no VOCs and is not toxic. Replaces Wh02.

Agfa, www.agfa.com