SPH1 family of compression connector products for flex-to-board and board-to-board applications combine high density and reliability with electrical performance. Come in area-array styles at 0.8mm, 1.0mm and 1.27mm pitch, with pin counts ranging from 80 to 120 positions. Interposer thicknesses range from 0.5mm to 3.0mm fully mated. RoHS 2002/95/EC compliant.

Neoconix, www.neoconix.com

RO-Linx PowerCircuit Busbars provide multifunction capability in a single, compact form factor. Distribute power and signal lines or can have components mounted on the busbar structures to save space and weight. Are 3D, for a range of power distribution applications in EV/HEVs, wind/solar power, and variable-frequency-drive (VFD) markets. Solder-process compatible.

Rogers Corp., rogerscorp.com

Simbeor signal integrity software, for physical design of PCB and packaging interconnects operating at 6-100 Gb/s and above, now features geometry import from ODB++ files to fit Simbeor into any design flow; Via Analyzer tool to synthesize geometry for transparent via-holes and connector launches; multi-variable optimization capability for geometry optimization and identification of dielectric and conductor roughness models; anisotropic dielectric model for accurate analysis of via-holes; Huray snowball and modified Hammerstad conductor roughness models for accurate analysis of PCB and packaging traces; and automatic computation, plotting and output of nine common serial interconnects compliance metrics.

Simberian, www.simberian.com

HyperLynx 8.2 suite of analysis tools offers new functionality for printed circuit board designs, including 3D full-wave field solving and integrated thermal/power co-simulation analysis capabilities.