LabVIEW now comes with NI Vision Development Module 2012, for developing a 3-D stereo vision system using any two cameras and performing advanced inspection and control using depth information from 3-D vision technology. Also works with third-party hardware and software tools for 3-D vision and combines 3-D images with other algorithms, such as pattern matching or object tracking, to profile stationary or moving objects.

Features include:

• High-precision 3-D image acquisition using new stereo vision and calibration algorithms in the Vision Development Module.
• Compatibility with third-party 3-D cameras, such as SICK Ranger cameras that use laser triangulation technology.
• Seamless integration of additional 3-D processing and analysis libraries, such as the AQSENSE SAL3D library, in the same graphical programming environment.

National Instruments, www.ni.com

Arduino Prototyping Shield for surface mount prototyping use novel "EZ" soldering technology for fast and easy soldering.

Microcopper ink material is based on micron copper particles for direct printing of electronic circuits for mobile devices, solar cells, display devices, etc. Is designed to replace silver-based conductors. Is applied on substrates by additive print processes such as screen, flexographic and gravure printing, as well as dispensing techniques. Is compatible with photosintering curing processes and equipment-enabling printed trace conductors on substrates with max. temperature limitations. Can be used as a patterned seed layer for electroplating and metal finishing.

Applied Nanotech Holdings, www.appliednanotech.net

CR-5000 v. 14 PCB and IC package design software features a number of productivity enhancements for collaboration in FPGA development and for high-speed design.