UTF Connector FTF Series for fine-pitch connections between high-density flexible circuits is said to provide a range of design flexibilities for packaging and termination in portable electronics products.
Novagard 800-230, 800-305, and 800-400 UV curable staking compounds are used as conformal coatings, potting compounds, inks, encapsulating and gasketing compounds and gels. UV 800-230 fast UV curing, single-component sealant is solvent-free; exhibits controlled rheology, no oxygen inhibition, has no corrosive byproducts, and cures quickly to solid rubber with UV irradiation at room temperature. UV 800-305 UV/dual cure sealant and adhesive is a noncorrosive, single-component silicone translucent paste sealant; cures to a solid rubber at room temperature. Exhibits controlled rheology and no oxygen inhibition. RTV 800-400 UV cure sealant is a noncorrosive, single-component silicone translucent paste sealant.
Novagard Solutions, www.novagard.com
NeoScale high-speed interconnect reportedly achieves signal integrity at 28+ Gbps data rates. For printed circuit board mezzanine applications in enterprise networking towers and telecommunication hubs and servers. Features triad wafer configuration that isolates each differential pair. Comprises three pins per differential pair: two signal pins and one shielded ground pin. Each triad is a standalone 28 Gbps differential pair with no additional ground pins required. Honeycomb construction routes each triad to minimize crosstalk and route out of the PCB in one or two layers. Tombstone structures located in the connector housing protect the mating interface and flexible contacts. Featuring a density of 82 differential pairs per sq. in., the layout can be customized with high-speed differential pairs, high-speed single-ended traces, low-speed single-ended lines and power contacts. Available with 85 and 100 Ohm impedance and mated stack height range of 12 to 40mm. Design options include 6 to 30 circuit column sizes with 2, 4, 6 and 8 row options available, ranging from 12 to 240 triads in one assembly. Plug assembly features a 2.80mm pitch between differential pairs.
Molex, www.molex.com
Windchill product lifecycle management software revision 10.1 integrates with Integrity lifecycle management software for rich, collaborative authoring and management capabilities and “flow-down” traceability.
DFM Now! version 6 verifies that Gerber, drill, and ODB++ files are ready for PCB manufacturing.
Sarcon D-Tac thermally conductive and electrically insulative double-sided tape is available in an acrylic or silicone base. Sarcon D-Tac 7A reinforced acrylic tape offers high adhesion strength with a thermal conductivity of 0.7 W/m•K and a thermal resistance as low as 3.5 º C•cm²/W. Is reportedly ideal for lower power densities. Sarcon D-Tac 9A silicone tape is for higher operating temperatures and provides a thermal conductivity of 0.9 W/m•K with a thermal resistance as low as 2.1 ºC•cm²/W.
Fujipoly America Corp., www.fujipoly.com