Paragon-Xpress 12 laser direct imaging system supports features sizes down to 20μm. Throughput reportedly up to 5,000 panels per day. Handles HDI, flex and rigid-flex printed circuit boards. Said to have high registration accuracy.

Orbotech, www.orbotech.com

EMPro 2012 electromagnetic professional software aids in creating 3D models; analyzes electrical performance of packages, connectors, antennas, and other RF and high-speed components. Integrates with Advanced Design System software. Has simulator enhancements. 3D objects can now be saved as ADS design database “cells” for use directly in ADS. A new low-frequency analysis algorithm improves accuracy below 100MHz, including at DC, in finite element method simulations. Has enhanced FEM meshing technology.

Agilent Technologies, www.agilent.com 

RO4835 high-frequency laminate is formulated for improved oxidation resistance. Dielectric constant is 3.48 and low loss tangent is 0.0037 at 10GHz.

The 2929 bondply system is an unreinforced hydrocarbon-based thin-film adhesive system intended for multilayer circuit constructions. Has a dielectric constant of 2.9 and low loss tangent of <0.003 at microwave frequencies. Proprietary crosslinkable resin system is compatible with sequential bond processing. Adhesive system flow management permits significant blind via fill capability. Is compatible with traditional flat press and autoclave bonding methods. Comes in 0.0015, 0.002, and 0.003 in. (0.038, 0.051, and 0.076mm) sheet thicknesses. Sheets can be stacked to yield thicker adhesive layers. Unreinforced thin film can be tack bonded to innerlayers for simultaneous machining of cutouts through core and adhesive layers. A carrier film protects the adhesive layer from contamination during machining and multi-layer-board booking processes.

Rogers, www.rogerscorp.com