Genesis 2000 version 9.9b and GenFlex version 2.9b have new interactive editing tools and a new job repair function that detects and repairs damaged jobs. Deliver enhancements to existing editor functionality and DFM actions, including sliver repair, drill checks and microvia checks. Genesis 2000 9.9b highlights: convert any feature to outline (e.g. slot to outline for rout) in several options; feature to outline conversion; split features to divide a feature into two and work on each part separately; split features by line reference; convert layer polarity; original layer (positive) and inverted layer (negative); apply a resize or offset transformation to a profile without converting the profile back to a layer; space tracks evenly from the middle of the bus; drill map creation, and sliver repair. GenFlex 2.9 features: automatic tooling holes placement and rigid/flex checks enhancements.
 
Frontline Solutions, www.frontline-pcb.com

LabVIEW FPGA IP Builder add-on uses Xilinx Vivado High-Level Synthesis technology to simplify high-performance field-programmable gate array (FPGA) algorithm design. Enhances productivity by reducing need for manual optimization of high-performance algorithms. When functional behavior and design constraints are specified, automatically generates a hardware implementation to meet requirements. Integrates with LabVIEW and the LabVIEW DSP Design Module. Features include increased FPGA design abstraction for enhanced productivity, improved algorithm performance and resource utilization, separation of code and design constraints facilitates IP reuse, seamless deployment to NI FPGA-based devices.

National Instruments, www.ni.com

Specialty conductive inks can be printed onto flat plastic substrate films using conventional screen, gravure or pad printing techniques. After drying, the plastic film can then be formed into shape using heat and pressure, and the printed conductive ink traces will follow the contour of the molded part. Even with sharp bends and deep draw sections in the molded part, the conductive ink traces will maintain conductivity. Electronic circuits fit easily into molded parts without the additional step of attaching a circuit to a molded part.

Conductive Compounds, http://www.conductivecompounds.com

PolyFLEX XF-100 series polyimide flexible substrates can be printed with resistive, conductive and semi-conductive inks. Are reportedly suitable for applications that demand dimensional stability after repetitive exposure to high temperatures. Resistant to chemicals normally used in printed circuit boards and electronic devices. Durable top coats enable high resolution printing. Offer dimensional and electrical stability  up to 300°C. Applications include printed electronics, flexible heaters, flexible OLEDs, temperature sensors, flex circuits, smart bandages, RFID antennas, portable devices and electrical circuits. Line includes 1 mil (25µm) to 5 mil (127µm) versions with white or clear print surfaces.

Polyonics, http://www.polyonics.com