Embedded Capacitance Material (ECM) C2006 thin laminate material has a capacitance density of approximately 20 nF per sq. in. Reportedly can improve power integrity and reduce electromagnetic interference in small devices such as microphones, sensors, IC packaging and interposers. Helps achieve high-fidelity signals, high signal-to-noise ratio in radio frequencies, and higher speed digital signals in high-performance applications.
3M Electronic Solution Division – Interconnect, www.3Mconnectors.com
OhmegaPly MTR permits thin-film resistors to be built within a printed circuit trace that is less than 100µm (0.004") wide. Uses standard subtractive printed circuit board processes; is reportedly ideal for HDI designs where passive component placement is difficult or impossible. Copper traces can be imaged and etched to define resistor widths, resulting in miniature resistors with consistent ohmic values. Are for line termination and pull-up/down applications. Delivers resistors to less than 50µm widths; 5µm and 17µm copper foil availability; resistor placement on plated surface or buried via layers.
Ohmega Technologies, www.ohmega.com
DataMan 50L compact barcode reader is designed for 1-D oriented barcode reading. Measures 23.5mm x 27mm x 43.5mm; features IP65-rated housing. Is reportedly ideal for mounting in tight spaces on production lines and in machinery. Equipped with Hotbars, image analysis technology. Read rates can surpass 99%. Has the ability to analyze “no reads” by letting the user see what the reader sees, live on a monitor or through image archiving. Is designed with no moving parts. Features three-position lens and integrated aimer.
Cognex, www.cognex.com/50L.aspx
ROCIT 2.0 now provides enhanced calibration, system de-skew algorithms and updated test routines for its RCI (Remote Controlled Impedance) test system. Is said to be capable of performing 5000 single ended TDR measurement per hour on backplane assemblies and bare printed circuit boards. Identifies defects that may cause failures in high speed traces. Identifies back drill and via stub variations down to 0.2mm.
Altium Designer 2013 includes updated printed circuit board features and fixes to core schematic and PCB tools. Opens up DXP platform. Includes home page redesign with new views and sub-views into license management, plug-ins and updates, and Workspace view; hyperlink text support in schematic documents; enhanced customization of schematic ports; Microchip Touch Controls Support, and silk-to-solder mask clearance rule.
Altium, www.altium.com
HyperLynx now includes advanced 3D channel and trace modeling, improved DDR signoff verification, and accelerated simulation performance.