Multisim 13.0 SPICE simulation environment is for circuit parameter and parameter sweep analysis. Features include digital circuits education using NI myRIO and Digilent FPGA targets; power electronics analysis with IGBT and MOSFET thermal models; device simulation for 26,000+ devices; design automation with the NI LabVIEW Multisim API Toolkit. Offers circuit analysis tools for analog, digital and power electronics. Includes courseware and lab hardware integration to NI myDAQ, NI ELVIS, NI myRIO and digital products from Digilent. Has ready-to-use daughterboard templates.

National Instruments, www.ni.com

TC-2030 and TC-2035 thermally conductive adhesives were developed to enable design of more compact, reliable and higher performing automotive electronics assemblies. Are two-part, heat-cured silicone technologies. TC-2030 has a thermal conductivity of 2.7 W/mK. Reportedly provides improvement in elongation performance. Has bond line thickness of 130µm. TC-2035 helps manage heat in automotive applications, including power electronics. Has 3.3 W/mK thermal conductivity and BLT as low as 50µm. Bonds to thermal substrates, including direct bonding copper, high-density interconnect, low-temperature co-fired ceramic and printed circuit boards. Sustains performance at temperatures reaching 200°C.

Dow Corning, www.dowcorning.com
 

BluePrint-PCB v. 3.6 software integrates BluePrint-PCB and Cadence OrCAD PCB Designer and Allegro PCB Layout tools. Integration automates the PCB documentation process for Cadence tools and eliminates all manual file transfer between applications. Automatically extracts and loads OrCAD and Allegro data. Works with new and existing PCB layouts. Automatically updates documentation packages created through the integration. Creates or updates existing documents directly from Allegro PCB Design System menus. EDA data transfer occurs automatically in the background. Sets hatch patterns for copper on PCB CAD layers, displays IPC standard annotation labels denoting the flip (mirror) status, displays process step filtered by an assembly variant in an assembly PCB view or process step chart. Sets drill symbol size for each hole size.

DownStream Technologies, www.downstreamtech.com
 

Excellence Analytical Balances feature indicator lights for full visibility that all balance calibration and routine tests are up to date and to ensure it is safe to start weighing. Static sensor indicates whether electrostatic charge is present by automatically checking samples and containers as they are placed on the balance. Fully compatible with LabX laboratory software.

Mettler Toledo, www.mt.com/green-light