New Products

Magnas series printed circuit board plasma etching treatment system is said to require only three-phase power and compressed air for desmear and etch back applications. Features high etch speed rates and uniformity. Lowers CF4 usage.

Plasma Etch, www.plasmaetch.com

Sprint 120 provides consistent, volume production of legend designs. Is said to eliminate entire screen mask preparation process and require only one baking cycle. Achieves production quality in a single pass with precise drop control and optimized algorithms for fine text and filled areas. Custom print heads are designed for printed circuit boards and processes. UV LED lights enable drop curing on-the-fly and printing of features down to 0.5mm. Automatic measurements and scaling for each panel. Registration accuracy of 35μm.

Orbotech, www.orbotech.com

Check out Board Talk, our new bulletin board: http://theprintedcircuitboard.com

 


 

Zebra 2004 elastomeric connector provides 140 electrical connections per inch when positioned between a circuit board and a parallel electronics device such as an LCD display. Is for devices with contact spacing as low as 0.020". Is made from alternating layers of conductive carbon-filled and non-conductive silicone. Delivers a current carrying capacity of 50 mA per 0.040" x 0.040" pad and can be specified in custom lengths up to 9". Comes in widths from 0.015" to 0.118" and has an operational temp. range of -40° to +100°C.

Fujipoly America, www.fujipoly.com

JetRite PCB legend printing system offers immediate UV curing. Is 73.23" deep by 59" wide. Delivers fast setup times and high-speed printing. Provides serial number, barcode, and other custom printing capabilities. Uses a constant recirculating ink design. Can be supplied with autoload and unload capability.

KLG, www.klg-maschinen.com/

The latest Altium Designer 10 update includes updated FPGA device and vendor tools support for Xilinx ISE 14.2 and Lattice Diamond 2.0 plus a new module for IDF export.

Read more ...

Cupra Etch DE is based on iron sulfate etch and effectively removes the seed layer of electroless copper. Eliminates undercuts and reduces waste water. Retains contour of the finest conductors. Requires no "feed and bleed" operation. Does not etch three-dimensionally.

Atotech, www.atotech.com

 

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