Microfill LVF Via Fill electrolytic copper for enhanced microvia filling is for electrolytic copper plating of high density interconnect (HDI) printed circuit boards (PCB). Reportedly is capable of 10–15μm plating thicknesses, microvia filling, high filling efficiency and reduced copper usage. Improves panel and pattern plating distribution and features thermal reliability.

Dow Chemical Co. www.dow.com

Microfill THF-100 electrolytic copper for through-hole fill of substrate core layers on IC substrate printed circuit boards (PCB).

PE8XX series screen-printed conductive inks for printed electronics are said to provide low resistivity. For use with standard thermal curing techniques and photonic curing equipment. Suitable for use in applications such as membrane switches, RFID, electroluminescent lighting and flexible displays.

DuPont Microcircuit Materials, http://mcm.dupont.com

IR LabMate thermal imaging camera is for electronics applications such as detecting short circuits and product design. Includes cables and image analysis software. Utilizes a 320x240 array detector, has a temperature sensitivity of 0.08˚C, uses an Ethernet interface, and comes with a wide angle lens. Optional accessories include camera stand, circuit board test probe, high calibration range, and relay output module to synchronize board power with software tests.

OptoTherm, www.optotherm.com